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Eaton Modular PLC XC104, Micro PLC, programmable CODESYS 3, USB, Ethernet, XN300 IO expandable
| Product Name |
Eaton XC100 modular PLC
|
| Catalog Number |
199971
|
| EAN |
4015081997602
|
| Product Length/Depth |
104.2 mm
|
| Product Height |
29.3 mm
|
| Product Width |
80.3 mm
|
| Product Weight |
0.11 kg
|
| Certifications |
UL listed
EN 61131 EAC UL File No.: E205091 CE cULus Listed |
| Model Code |
XC-104-C10-000
|
| Fitted with: |
XSOFT-CODESYS 3
|
| Functions |
Additional program memory possible
|
| Emitted interference |
40 dB (at 30 - 230 MHz, Class A, radiated, high frequency)
47 dB (at 230 - 1000 MHz, Class A, radiated, high frequency) |
| Connection type |
Push-in spring-cage terminal, Connection design in TOP direction
|
| Degree of protection |
IP20
|
| Memory capacity |
256,000 kByte
|
| Model |
Modular
|
| Mounting method |
Rail mounting possible
|
| Overvoltage category |
II
|
| Pollution degree |
2
|
| Voltage type |
DC
|
| Mounting position |
Vertical (on horizontal top-hat rail)
|
| Shock resistance |
15 g, Mechanical, according to IEC/EN 60068-2-27, Half-sinusoidal shock 11 ms, 9 Impacts
|
| Vibration resistance |
5 - 8.4 / 8.4 -150 Hz, 3,5 mm / 1 g
|
| Air pressure |
795 - 1080 hPa (operation)
|
| Ambient operating temperature - min |
-20 °C
|
| Ambient operating temperature - max |
60 °C
|
| Ambient storage temperature - min |
-25 °C
|
| Ambient storage temperature - max |
70 °C
|
| Relative humidity |
< 95 % (non-condensing)
|
| Terminal capacity (AWG) |
24 - 16
|
| Terminal capacity (flexible with ferrule) |
0.25 - 1.5 mm², with ferrules without plastic collar according to DIN 46228-1 (ferrules crimped gas-tight)
0.25 - 1.5 mm², with ferrules with plastic collar according to DIN 46228-1 (ferrules crimped gas-tight) |
| Terminal capacity (flexible) |
0.2 - 1.5 mm², H 07V-K
|
| Terminal capacity (solid) |
0.2 - 1.5 mm², H07V-U
|
| Supply voltage at DC - min |
19.2 VDC
|
| Voltage dips |
20 ms
10 ms |
| Supply voltage at DC - max |
30 VDC
|
| Connection type |
Push-in spring-cage terminal, Connection design in TOP direction
|
| Interfaces |
ETH
XN300 |
| Protocol |
EtherNet/IP
MODBUS Other bus systems TCP/IP |
| Number of channels |
0
|
| Number of inputs (analog) |
0
|
| Number of inputs (digital) |
0
|
| Number of outputs (analog) |
0
|
| Number of outputs (digital) |
0
|
| Number of relay outputs |
0
|
| Rated operational current (Ie) |
1 A (supply input)
|
| Explosion safety category for dust |
None
|
| Explosion safety category for gas |
None
|
| Heat dissipation details |
The max. heat dissipation is specified as the maximum power produced inside the device's housing.
|
| 10.2.2 Corrosion resistance |
Meets the product standard's requirements.
|
| 10.2.3.1 Verification of thermal stability of enclosures |
Meets the product standard's requirements.
|
| 10.2.3.2 Verification of resistance of insulating materials to normal heat |
Meets the product standard's requirements.
|
| 10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects |
Meets the product standard's requirements.
|
| 10.2.4 Resistance to ultra-violet (UV) radiation |
Meets the product standard's requirements.
|
| 10.2.5 Lifting |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.2.6 Mechanical impact |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.2.7 Inscriptions |
Meets the product standard's requirements.
|
| 10.3 Degree of protection of assemblies |
Meets the product standard's requirements.
|
| 10.4 Clearances and creepage distances |
Meets the product standard's requirements.
|
| 10.5 Protection against electric shock |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.6 Incorporation of switching devices and components |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.7 Internal electrical circuits and connections |
Is the panel builder's responsibility.
|
| 10.8 Connections for external conductors |
Is the panel builder's responsibility.
|
| 10.9.2 Power-frequency electric strength |
Is the panel builder's responsibility.
|
| 10.9.3 Impulse withstand voltage |
Is the panel builder's responsibility.
|
| 10.9.4 Testing of enclosures made of insulating material |
Is the panel builder's responsibility.
|
| 10.10 Temperature rise |
The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
|
| 10.11 Short-circuit rating |
Is the panel builder's responsibility.
|
| 10.12 Electromagnetic compatibility |
Is the panel builder's responsibility.
|
| 10.13 Mechanical function |
The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.
|
Product specifications
