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Eaton XIOC Analog input card for XC100/200, 24 V DC, 8DI(+/-10V)
| Product Name |
Eaton XIOC Accessory Input card
|
| Catalog Number |
257900
|
| EAN |
4015082579005
|
| Product Length/Depth |
100 mm
|
| Product Height |
95 mm
|
| Product Width |
30 mm
|
| Product Weight |
0.135 kg
|
| Certifications |
UL508
CSA-C22.2 No. 142-M CSA UL Category Control No.: NRAQ IEC/EN 61131-2 UL File No.: E135462 CSA Class No.: 2252-01 EN 50178 CE CSA File No.: 012528 CSA-C22.2 No. 0-M UL |
| Model Code |
XIOC-8AI-U2
|
| Electric connection type |
Screw-/spring clamp connection
|
| Features |
Input, voltage
Analog outputs configurable Analog inputs configurable |
| Admissible range |
20.4 – 28.8 V (11.8 – 14.4 V), Power supply
|
| Current consumption |
100 mA (typ.), internal (5 V DC), Inputs
|
| Degree of protection |
IP20
|
| Number of channels |
8, Input
|
| Overvoltage category |
II
|
| Pollution degree |
2
|
| Protection class |
1
|
| Repetition rate |
1 s
|
| Residual ripple |
≤ 5 %
|
| Resolution |
12 Bit (digital)
|
| Type |
Analog module
|
| Used with |
XC100/200 (expandable with up to 15 XI/OC modules)
|
| Impact resistance |
500 g/⌀ 50 mm ±25 g
|
| Shock resistance |
15 g, Mechanical, Shock duration 11 ms
|
| Vibration resistance |
10 - 57 Hz, ± 0.075 mm
57 - 150 Hz ± 1.0 mm |
| Ambient operating temperature - min |
0 °C
|
| Ambient operating temperature - max |
55 °C
|
| Ambient storage temperature - min |
-25 °C
|
| Ambient storage temperature - max |
70 °C
|
| Emitted interference |
Class A (according to DIN/EN 55011/22)
|
| Voltage dips |
10 ms
|
| Terminals |
|
| Power loss |
Max. 0.5 W
|
| Power supply |
24 V DC (-15/+20 %), approx. 150 mA
|
| Rated operational voltage |
24 (12) V DC
|
| Connection type |
2-core screened cable (≤ 20 m)
|
| Conversions |
≤ 5 ms
|
| Input |
8 Inputs (±10 V)
|
| Input impedance |
100 kΩ
|
| Input voltage |
-10 - 10 V DC (Input modules)
|
| Number of inputs (analog) |
8
|
| Number of outputs (analog) |
0
|
| Total error |
≤ ±1 % (of the full-scale value), Inputs
|
| Explosion safety category for dust |
None
|
| Explosion safety category for gas |
None
|
| Potential isolation |
Analog inputs: Opto-isolated
Analog outputs: no |
| Equipment heat dissipation, current-dependent Pvid |
0 W
|
| Heat dissipation capacity Pdiss |
0 W
|
| Heat dissipation per pole, current-dependent Pvid |
0 W
|
| Rated operational current for specified heat dissipation (In) |
0 A
|
| Static heat dissipation, non-current-dependent Pvs |
4.8 W
|
| 10.2.2 Corrosion resistance |
Meets the product standard's requirements.
|
| 10.2.3.1 Verification of thermal stability of enclosures |
Meets the product standard's requirements.
|
| 10.2.3.2 Verification of resistance of insulating materials to normal heat |
Meets the product standard's requirements.
|
| 10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects |
Meets the product standard's requirements.
|
| 10.2.4 Resistance to ultra-violet (UV) radiation |
Meets the product standard's requirements.
|
| 10.2.5 Lifting |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.2.6 Mechanical impact |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.2.7 Inscriptions |
Meets the product standard's requirements.
|
| 10.3 Degree of protection of assemblies |
Meets the product standard's requirements.
|
| 10.4 Clearances and creepage distances |
Meets the product standard's requirements.
|
| 10.5 Protection against electric shock |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.6 Incorporation of switching devices and components |
Does not apply, since the entire switchgear needs to be evaluated.
|
| 10.7 Internal electrical circuits and connections |
Is the panel builder's responsibility.
|
| 10.8 Connections for external conductors |
Is the panel builder's responsibility.
|
| 10.9.2 Power-frequency electric strength |
Is the panel builder's responsibility.
|
| 10.9.3 Impulse withstand voltage |
Is the panel builder's responsibility.
|
| 10.9.4 Testing of enclosures made of insulating material |
Is the panel builder's responsibility.
|
| 10.10 Temperature rise |
The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
|
| 10.11 Short-circuit rating |
Is the panel builder's responsibility.
|
| 10.12 Electromagnetic compatibility |
Is the panel builder's responsibility.
|
| 10.13 Mechanical function |
The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.
|