Multiple duct banks and backfills module
Conduct thermal analysis and modeling for cables installed in duct banks and backfills
Eaton's multiple duct banks and backfills module (CYMCAP/MDB) is designed to determine the steady-state ampacity of cables installed in several neighboring duct banks and/or backfills with different thermal resistivity.
It computes the values of T4 (the external thermal resistance to the cable) using the finite element method. The ampacity (or operating temperature) of the cable installation is obtained using the IEC standardized solution method.
Highlighted features:
Advanced tunnel modeling module
Cables in troughs module
Multiple casings module
Submarine cable installations module
Cable impedance calculation module
Magnetic fields module
Cables crossings module
Short circuit cable rating module
Duct back optimizer module
Parametric studies module
Soil dry-out analysis module
3D modeling module
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