Conduct thermal analysis and modeling for cables installed in duct banks and backfills
Eaton's multiple duct banks and backfills module (CYMCAP/MDB) is designed to determine the steady-state ampacity of cables installed in several neighboring duct banks and/or backfills with different thermal resistivity.
It computes the values of T4 (the external thermal resistance to the cable) using the finite element method. The ampacity (or operating temperature) of the cable installation is obtained using the IEC standardized solution method.
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