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  • Duct banks and backfields module

    Multiple duct banks and backfills module

    The multiple duct banks and backfills module (CYMCAP/MDB) provides advanced capabilities to the power cable ampacity software. It enables the modelling of installations with various duct banks and backfills, each featuring different thermal resistivity.
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Conduct thermal analysis and modelling for cables installed in duct banks and backfills 

Eaton's multiple duct banks and backfills module (CYMCAP/MDB) is designed to determine the steady-state ampacity of cables installed in several neighbouring duct banks and/or backfills with different thermal resistivity.

It computes the values of T4 (the external thermal resistance to the cable) using the finite element method. The ampacity (or operating temperature) of the cable installation is obtained using the IEC standardised solution method. 

Highlighted features: 

  • Allows modelling of multiple rectangular or circular soil areas (duct banks and backfills) with different thermal resistivity
  • Provides the ability to model heat sources or heat sinks in the installation
  • Calculates the steady-state ampacity or temperature
  • Supports transient analysis, cyclic loading and emergency ratings
  • Computes the thermal rating of cables installed in filled troughs
Multiple ductbanks and backfills
769719669

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