Multiple duct banks and backfills module
Conduct thermal analysis and modelling for cables installed in duct banks and backfills
Eaton's multiple duct banks and backfills module (CYMCAP/MDB) is designed to determine the steady-state ampacity of cables installed in several neighbouring duct banks and/or backfills with different thermal resistivity.
It computes the values of T4 (the external thermal resistance to the cable) using the finite element method. The ampacity (or operating temperature) of the cable installation is obtained using the IEC standardised solution method.
Highlighted features:
Advanced tunnel modelling module
Cables in troughs module
Multiple casings module
Submarine cable installations module
Cable impedance calculation module
Magnetic fields module
Cables crossing module
Short-circuit cable rating module
Duct back optimiser module
Parametric studies module
Soil dry-out analysis module
3D modelling module
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