Molded inductor (HCM, HPAL)

Eaton’s molded HCM and HPAL inductors use pressed powder and alloy construction providing a robust high current low EMI inductor ideal for computing and server applications. Both HCM and HPAL molded construction provides a soft inductance rolloff across a wide range of current ratings and operating temperatures between -55 °C to +125 °C with superior heat dissipation and low EMI. The HCM and HPAL offers superior performance with current ratings up to 118 A. The HCM product uses an advanced pressed iron powder for superior Isat, while the HPAL uses alloy powder offering higher lower DCR and irms.

With a wide variety of SMT package sizes from 5 mm to 17 mm and inductance values up to 68 uH (HPAL1V up to 10 uH), the HCM and HPAL is ideal for wide range of applications in computing, industrial, energy and consumer products; including voltage regulator module (VRM), multi-phase regulators, point-of-load modules, desktop, datacenter/server VRMs and EVRDs, base station equipment, notebook and laptop regulators and battery power systems, industrial equipment, solar, and wind applications.